EP4SGX360FF35C4 vs EP4SGX360FF35I3 对比
详细并排对比 EP4SGX360FF35C4 出自 Intel 和 EP4SGX360FF35I3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP4SGX360FF35C4 | EP4SGX360FF35I3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $5,189.41 | $1,695.00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353600 | — |
| Number of LABs/CLBs | 14144 | — |
| Total RAM Bits | 23105536 | 23,105,536 |
| Number of I/O | 564 | — |
| Number of Transceivers | 8 | [DATA_NEEDED: transceiver count] |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm | 40 nm |
| 封装 | 1152-BBGA, FCBGA (flip-chip) | 1152-BBGA, FCBGA (Flip-Chip) |
| 工作温度 | 0C to +85C (commercial) | -40C to +100C |
| 安装类型 | Surface Mount | Surface Mount |
| MSL 等级 | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL] |
| RoHS 状态 | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes (per BGA finish) | — |
| Supplier Device Package | 1152-FBGA | — |
| Series | — | Stratix IV GX |
| Logic Elements (LE) | — | 353,600 |
| LABs/CLBs | — | 14,144 |
| Embedded Memory | — | [DATA_NEEDED: total Kbits] |
| User I/O Count | — | 564 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Transceiver Data Rate (max) | — | [DATA_NEEDED: Gbps] |
| Number of PLLs | — | [DATA_NEEDED: PLL count] |
| Speed Grade | — | I3 |