EP4SGX360HF35C2 vs EP4SGX360HF35I3N Vergleich
Detaillierter Direktvergleich von EP4SGX360HF35C2 von Intel und EP4SGX360HF35I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP4SGX360HF35I3N - Stratix IV GX FPGA, 353K LE, 1152-FBGA | Intel
EP4SGX360HF35I3N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP4SGX360HF35C2 | EP4SGX360HF35I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9.750,00 | $1.925,00 |
| Series | Stratix IV GX | — |
| Family | Stratix IV GX FPGA | Stratix IV GX |
| Logic Elements (LEs) | 353,600 | — |
| LABs/CLBs | 14,144 | — |
| Number of I/O | 564 (max 532 user I/O) | — |
| Embedded Memory (bits) | 23,105,536 | — |
| Number of Logic Cells | 353,600 | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm | 40 nm |
| Transceivers | Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable) | Up to 24 channels |
| Package Type | 1152-pin FC-FBGA | — |
| Package Code | HF35 (35x35 mm, 1.0 mm pitch) | — |
| Montageart | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Betriebstemperatur | 0C to +85C (commercial) | -40C to +100C (industrial) |
| RoHS-Status | Compliant | — |
| Configuration | JTAG / Active Serial (external config device) | — |
| Design Tool | Quartus II / Quartus Prime | — |
| Logic Elements (LE) | — | 353,600 |
| Adaptive Logic Modules (ALMs) | — | 141,440 |
| Logic Array Blocks (LABs) | — | 14,144 |
| User I/Os | — | 564 |
| Block RAM (M9K + M144K) | — | 22.4 Mbits |
| Embedded Multipliers (18x18) | — | 1,040 |
| Max Transceiver Data Rate | — | 8.5 Gbps |
| PCIe Hard IP | — | Gen1/Gen2 x1/x2/x4 |
| Gehäuse | — | 1152-ball FC-FBGA (HF35, 35x35 mm) |
| Lead Free | — | Yes |