EP4SGX360HF35C3 vs EP4SGX360HF35C2 Vergleich

Detaillierter Direktvergleich von EP4SGX360HF35C3 von Intel und EP4SGX360HF35C2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP4SGX360HF35C3 EP4SGX360HF35C2
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $6.850,00 $9.750,00
Series Stratix IV GX Stratix IV GX
Manufacturer Intel (formerly Altera) —
Logic Elements 353,600 —
Total Memory Bits 23,105,536 (22.5 Mbit) —
Number of LABs 14,144 —
User I/O Count 564 —
Gehäuse 1152-BBGA, FCBGA (FineLine BGA) —
Montageart Surface Mount Surface Mount (Flip-Chip BGA)
Process Node 40 nm —
Supply Voltage - Core [DATA_NEEDED: core voltage] —
Betriebstemperatur Commercial (0C to +85C) - inferred from C3 suffix 0C to +85C (commercial)
Transceivers Multi-gigabit serial transceivers integrated Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable)
DSP Blocks Variable-precision DSP blocks —
Memory Controllers Hard memory controller blocks —
PCI Express Hard IP Yes (PCIe Gen2 capable per family) —
RoHS-Status [DATA_NEEDED: RoHS status] Compliant
Development Tool Quartus II Design Software (v13.0 or later) —
Family — Stratix IV GX FPGA
Logic Elements (LEs) — 353,600
LABs/CLBs — 14,144
Number of I/O — 564 (max 532 user I/O)
Embedded Memory (bits) — 23,105,536
Number of Logic Cells — 353,600
Core Voltage — 0.9 V
Process Technology — 40 nm
Package Type — 1152-pin FC-FBGA
Package Code — HF35 (35x35 mm, 1.0 mm pitch)
Configuration — JTAG / Active Serial (external config device)
Design Tool — Quartus II / Quartus Prime

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern