EP4SGX360HF35I3N vs EP4SGX360HF35C2 Vergleich
Detaillierter Direktvergleich von EP4SGX360HF35I3N von Intel und EP4SGX360HF35C2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP4SGX360HF35I3N - Stratix IV GX FPGA, 353K LE, 1152-FBGA | Intel
EP4SGX360HF35I3N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP4SGX360HF35I3N | EP4SGX360HF35C2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.925,00 | $9.750,00 |
| Family | Stratix IV GX | Stratix IV GX FPGA |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALMs) | 141,440 | — |
| Logic Array Blocks (LABs) | 14,144 | — |
| User I/Os | 564 | — |
| Block RAM (M9K + M144K) | 22.4 Mbits | — |
| Embedded Multipliers (18x18) | 1,040 | — |
| Transceivers | Up to 24 channels | Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable) |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| PCIe Hard IP | Gen1/Gen2 x1/x2/x4 | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| Betriebstemperatur | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Gehäuse | 1152-ball FC-FBGA (HF35, 35x35 mm) | — |
| Montageart | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Lead Free | Yes | — |
| Series | — | Stratix IV GX |
| Logic Elements (LEs) | — | 353,600 |
| LABs/CLBs | — | 14,144 |
| Number of I/O | — | 564 (max 532 user I/O) |
| Embedded Memory (bits) | — | 23,105,536 |
| Number of Logic Cells | — | 353,600 |
| Package Type | — | 1152-pin FC-FBGA |
| Package Code | — | HF35 (35x35 mm, 1.0 mm pitch) |
| RoHS-Status | — | Compliant |
| Configuration | — | JTAG / Active Serial (external config device) |
| Design Tool | — | Quartus II / Quartus Prime |