EP4SGX360HF35I3N vs EP4SGX360HF35C2 对比
详细并排对比 EP4SGX360HF35I3N 出自 Intel 和 EP4SGX360HF35C2 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP4SGX360HF35I3N | EP4SGX360HF35C2 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,925.00 | $9,750.00 |
| Family | Stratix IV GX | Stratix IV GX FPGA |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALMs) | 141,440 | — |
| Logic Array Blocks (LABs) | 14,144 | — |
| User I/Os | 564 | — |
| Block RAM (M9K + M144K) | 22.4 Mbits | — |
| Embedded Multipliers (18x18) | 1,040 | — |
| Transceivers | Up to 24 channels | Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable) |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| PCIe Hard IP | Gen1/Gen2 x1/x2/x4 | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| 工作温度 | -40C to +100C (industrial) | 0C to +85C (commercial) |
| 封装 | 1152-ball FC-FBGA (HF35, 35x35 mm) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Lead Free | Yes | — |
| Series | — | Stratix IV GX |
| Logic Elements (LEs) | — | 353,600 |
| LABs/CLBs | — | 14,144 |
| Number of I/O | — | 564 (max 532 user I/O) |
| Embedded Memory (bits) | — | 23,105,536 |
| Number of Logic Cells | — | 353,600 |
| Package Type | — | 1152-pin FC-FBGA |
| Package Code | — | HF35 (35x35 mm, 1.0 mm pitch) |
| RoHS 状态 | — | Compliant |
| Configuration | — | JTAG / Active Serial (external config device) |
| Design Tool | — | Quartus II / Quartus Prime |