EP4SGX360KF40C2 vs EP4SGX360FH29C2X Vergleich
Detaillierter Direktvergleich von EP4SGX360KF40C2 von Intel und EP4SGX360FH29C2X von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360KF40C2 | EP4SGX360FH29C2X |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10.400,00 | $3.050,00 |
| Family | Stratix IV GX | — |
| Process Technology | 40 nm | 40 nm |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | 212,160 (estimated from LE) | — |
| Embedded Memory (Bits) | 23,105,536 (17.7 Mbits M20K) | — |
| User I/O Count | 744 | — |
| Transceiver Count | Up to 24 | — |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| PCIe Hard IP | PCIe Gen2 x8 (Gen1 compatible) | — |
| DSP Blocks | 1,040 (variable precision) | — |
| Core Voltage | 0.9 V | — |
| Speed Grade | C2 (commercial) | C2 |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Gehäuse | 1517-ball FCBGA, 42.5 x 42.5 mm | 780-BBGA, FCBGA (33x33 mm) |
| Montageart | Surface Mount (flip-chip BGA) | Surface Mount |
| MSL-Level | MSL3 (per JEDEC J-STD-020) | 3 |
| RoHS-Status | Compliant | Compliant |
| Series | — | Stratix IV GX |
| Logic Elements | — | 353600 |
| LABs/CLBs | — | 14144 |
| Total RAM Bits | — | 23105536 |
| Number of I/O | — | 289 |
| Number of Transceivers | — | 24 |
| Transceiver Data Rate | — | Up to 8.5 Gbps |
| Core Voltage Supply | — | 0.87 V to 0.93 V |
| Operating Temperature Grade | — | Commercial |