EP4SGX360KF40C2 vs EP4SGX360HF35I3 Vergleich
Detaillierter Direktvergleich von EP4SGX360KF40C2 von Intel und EP4SGX360HF35I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360KF40C2 | EP4SGX360HF35I3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10.400,00 | $650,00 |
| Family | Stratix IV GX | Stratix IV GX Field Programmable Gate Array |
| Process Technology | 40 nm | 40 nm |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | 212,160 (estimated from LE) | — |
| Embedded Memory (Bits) | 23,105,536 (17.7 Mbits M20K) | — |
| User I/O Count | 744 | — |
| Transceiver Count | Up to 24 | — |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| PCIe Hard IP | PCIe Gen2 x8 (Gen1 compatible) | — |
| DSP Blocks | 1,040 (variable precision) | Yes (hard DSP blocks) |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C2 (commercial) | F35 |
| Betriebstemperatur | 0C to +85C (commercial) | -40 °C to +100 °C (Industrial) |
| Gehäuse | 1517-ball FCBGA, 42.5 x 42.5 mm | — |
| Montageart | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| MSL-Level | MSL3 (per JEDEC J-STD-020) | — |
| RoHS-Status | Compliant | Compliant |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix IV GX |
| Logic Elements (LEs) | — | 353,600 |
| Total LABs | — | 14,144 |
| Embedded Memory (bits) | — | 23,105,536 |
| User I/Os | — | 564 |
| Package Type | — | 1152-Ball FCBGA (FineLine BGA) |
| I/O Standards Supported | — | LVDS, LVTTL, LVPECL, HSTL, SSTL |
| Embedded Transceivers | — | Yes (multi-gigabit) |
| Configuration Modes | — | Serial, Parallel, JTAG, Active Serial |