EP4SGX360KF40C2 vs EP4SGX360HF35I3 Comparación
Comparación detallada lado a lado de EP4SGX360KF40C2 por Intel y EP4SGX360HF35I3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX360KF40C2 | EP4SGX360HF35I3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10.400,00 | $650,00 |
| Family | Stratix IV GX | Stratix IV GX Field Programmable Gate Array |
| Process Technology | 40 nm | 40 nm |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | 212,160 (estimated from LE) | — |
| Embedded Memory (Bits) | 23,105,536 (17.7 Mbits M20K) | — |
| User I/O Count | 744 | — |
| Transceiver Count | Up to 24 | — |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| PCIe Hard IP | PCIe Gen2 x8 (Gen1 compatible) | — |
| DSP Blocks | 1,040 (variable precision) | Yes (hard DSP blocks) |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C2 (commercial) | F35 |
| Temperatura de funcionamiento | 0C to +85C (commercial) | -40 °C to +100 °C (Industrial) |
| Encapsulado | 1517-ball FCBGA, 42.5 x 42.5 mm | — |
| Tipo de montaje | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Nivel MSL | MSL3 (per JEDEC J-STD-020) | — |
| Estado RoHS | Compliant | Compliant |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix IV GX |
| Logic Elements (LEs) | — | 353,600 |
| Total LABs | — | 14,144 |
| Embedded Memory (bits) | — | 23,105,536 |
| User I/Os | — | 564 |
| Package Type | — | 1152-Ball FCBGA (FineLine BGA) |
| I/O Standards Supported | — | LVDS, LVTTL, LVPECL, HSTL, SSTL |
| Embedded Transceivers | — | Yes (multi-gigabit) |
| Configuration Modes | — | Serial, Parallel, JTAG, Active Serial |