EP4SGX360NF45C3 vs EP4SGX230HF35I4G Vergleich
Detaillierter Direktvergleich von EP4SGX360NF45C3 von Intel und EP4SGX230HF35I4G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360NF45C3 | EP4SGX230HF35I4G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.750,00 | $7.900,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | 228,000 |
| Logic Array Blocks (LABs) | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| Maximum User I/O | 920 | — |
| Transceivers | Embedded multi-gigabit transceivers (GX) | — |
| Transceiver Data Rate | Up to 6.5 Gbps (per Stratix IV GX family) | — |
| Hard PCI Express Blocks | Yes (Gen1 / Gen2) | — |
| DSP Blocks | Dedicated variable-precision DSP blocks | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | 0.93 V |
| Gehäuse | 1932-ball FC-FBGA (NF45) | 1152-ball FCBGA (HF35) |
| Betriebstemperatur | Commercial (C3 speed grade) | -40C to +100C (Industrial) |
| Montageart | Surface Mount (flip-chip BGA) | Surface Mount (Flip-Chip BGA) |
| RoHS-Status | [DATA_NEEDED: rohs status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Embedded Memory (Bits) | — | 17,544,192 |
| Embedded Memory (Mbit) | — | 17.5 Mbit |
| 18x18 Multipliers | — | 1,728 |
| User I/O Pins | — | 564 |
| Transceiver Channels | — | 8 (up to 8.5 Gbps) |
| Process Node | — | 40 nm |
| Hard PCIe IP Cores | — | PCIe Gen1/Gen2 (x1/x4/x8) |
| PLLs | — | 24 |
| LVDS Performance | — | 1,335 Mbit/s |
| Configuration Scheme | — | Passive Serial, Fast Passive Parallel, JTAG |