EP4SGX360NF45C3 vs EP4SGX230HF35I4G 对比
详细并排对比 EP4SGX360NF45C3 出自 Intel 和 EP4SGX230HF35I4G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP4SGX360NF45C3 | EP4SGX230HF35I4G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3,750.00 | $7,900.00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | 228,000 |
| Logic Array Blocks (LABs) | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| Maximum User I/O | 920 | — |
| Transceivers | Embedded multi-gigabit transceivers (GX) | — |
| Transceiver Data Rate | Up to 6.5 Gbps (per Stratix IV GX family) | — |
| Hard PCI Express Blocks | Yes (Gen1 / Gen2) | — |
| DSP Blocks | Dedicated variable-precision DSP blocks | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | 0.93 V |
| 封装 | 1932-ball FC-FBGA (NF45) | 1152-ball FCBGA (HF35) |
| 工作温度 | Commercial (C3 speed grade) | -40C to +100C (Industrial) |
| 安装类型 | Surface Mount (flip-chip BGA) | Surface Mount (Flip-Chip BGA) |
| RoHS 状态 | [DATA_NEEDED: rohs status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Embedded Memory (Bits) | — | 17,544,192 |
| Embedded Memory (Mbit) | — | 17.5 Mbit |
| 18x18 Multipliers | — | 1,728 |
| User I/O Pins | — | 564 |
| Transceiver Channels | — | 8 (up to 8.5 Gbps) |
| Process Node | — | 40 nm |
| Hard PCIe IP Cores | — | PCIe Gen1/Gen2 (x1/x4/x8) |
| PLLs | — | 24 |
| LVDS Performance | — | 1,335 Mbit/s |
| Configuration Scheme | — | Passive Serial, Fast Passive Parallel, JTAG |