EP4SGX360NF45C3 vs EP4SGX230HF35I4G Comparación
Comparación detallada lado a lado de EP4SGX360NF45C3 por Intel y EP4SGX230HF35I4G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX360NF45C3 | EP4SGX230HF35I4G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.750,00 | $7.900,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | 228,000 |
| Logic Array Blocks (LABs) | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| Maximum User I/O | 920 | — |
| Transceivers | Embedded multi-gigabit transceivers (GX) | — |
| Transceiver Data Rate | Up to 6.5 Gbps (per Stratix IV GX family) | — |
| Hard PCI Express Blocks | Yes (Gen1 / Gen2) | — |
| DSP Blocks | Dedicated variable-precision DSP blocks | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | 0.93 V |
| Encapsulado | 1932-ball FC-FBGA (NF45) | 1152-ball FCBGA (HF35) |
| Temperatura de funcionamiento | Commercial (C3 speed grade) | -40C to +100C (Industrial) |
| Tipo de montaje | Surface Mount (flip-chip BGA) | Surface Mount (Flip-Chip BGA) |
| Estado RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Embedded Memory (Bits) | — | 17,544,192 |
| Embedded Memory (Mbit) | — | 17.5 Mbit |
| 18x18 Multipliers | — | 1,728 |
| User I/O Pins | — | 564 |
| Transceiver Channels | — | 8 (up to 8.5 Gbps) |
| Process Node | — | 40 nm |
| Hard PCIe IP Cores | — | PCIe Gen1/Gen2 (x1/x4/x8) |
| PLLs | — | 24 |
| LVDS Performance | — | 1,335 Mbit/s |
| Configuration Scheme | — | Passive Serial, Fast Passive Parallel, JTAG |