EP4SGX530HH35I3N vs EP4SGX530HH35C4N Vergleich

Detaillierter Direktvergleich von EP4SGX530HH35I3N von Intel und EP4SGX530HH35C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP4SGX530HH35C4N EP4SGX530HH35C4N - 531K LE Stratix IV GX FPGA | Intel | 1152-FCBGA

EP4SGX530HH35C4N - 531K LE Stratix IV GX FPGA | Intel | 1152-FCBGA

EP4SGX530HH35C4N ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP4SGX530HH35I3N EP4SGX530HH35C4N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $3.200,00 $3.490,00
Family Stratix IV GX Stratix IV GX
Device Type FPGA - Field Programmable Gate Array —
Logic Elements 531,200 531,200
Adaptive Logic Modules (ALMs) 21,248 —
Embedded Memory (bits) 28,033,024 —
Logic Blocks / LABs 21,248 —
Maximum User I/Os 564 —
DSP Blocks 1,024 (18x18 multipliers) —
Transceivers 24 channels Up to 24 channels at up to 8.5 Gbps (family maximum)
Transceiver Data Rate (max) 8.5 Gbps —
PLLs 8 (fractional support) —
Betriebstemperatur -40C to +85C (industrial) —
Internal Frequency (max) 800 MHz —
Gehäuse 1152-ball FCBGA (HBGA), 42.5 x 42.5 mm, 1.0 mm pitch 1152-ball FCBGA (Flip-Chip BGA)
Montageart Surface Mount (BGA) Surface Mount (BGA)
RoHS-Status Compliant —
Lead-Free Yes —
MSL-Level 3 [DATA_NEEDED: MSL level]
Process Node 40 nm —
Logic Array Blocks (LABs) — 21,248
Total RAM Bits — 28,033,024 (approximately 28 Mb)
User I/O Pins — 564
Process Technology — 40 nm CMOS
Core Voltage (typical) — 0.9 V
Speed Grade — C4
Temperature Grade — Commercial
Lead-Free / RoHS — Yes (RoHS compliant per N designator)
Lebenszyklusstatus — Last Time Buy (mature device, recommended for new designs migrating to Stratix 10 or Agilex)

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern