EP4SGX530HH35I3N vs EP4SGX530HH35C4N 对比
详细并排对比 EP4SGX530HH35I3N 出自 Intel 和 EP4SGX530HH35C4N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP4SGX530HH35I3N | EP4SGX530HH35C4N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3,200.00 | $3,490.00 |
| Family | Stratix IV GX | Stratix IV GX |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 531,200 | 531,200 |
| Adaptive Logic Modules (ALMs) | 21,248 | — |
| Embedded Memory (bits) | 28,033,024 | — |
| Logic Blocks / LABs | 21,248 | — |
| Maximum User I/Os | 564 | — |
| DSP Blocks | 1,024 (18x18 multipliers) | — |
| Transceivers | 24 channels | Up to 24 channels at up to 8.5 Gbps (family maximum) |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| PLLs | 8 (fractional support) | — |
| 工作温度 | -40C to +85C (industrial) | — |
| Internal Frequency (max) | 800 MHz | — |
| 封装 | 1152-ball FCBGA (HBGA), 42.5 x 42.5 mm, 1.0 mm pitch | 1152-ball FCBGA (Flip-Chip BGA) |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS 状态 | Compliant | — |
| Lead-Free | Yes | — |
| MSL 等级 | 3 | [DATA_NEEDED: MSL level] |
| Process Node | 40 nm | — |
| Logic Array Blocks (LABs) | — | 21,248 |
| Total RAM Bits | — | 28,033,024 (approximately 28 Mb) |
| User I/O Pins | — | 564 |
| Process Technology | — | 40 nm CMOS |
| Core Voltage (typical) | — | 0.9 V |
| Speed Grade | — | C4 |
| Temperature Grade | — | Commercial |
| Lead-Free / RoHS | — | Yes (RoHS compliant per N designator) |
| 生命周期状态 | — | Last Time Buy (mature device, recommended for new designs migrating to Stratix 10 or Agilex) |