EP4SGX70DF29C4G vs EP4SGX110DF29C3G Vergleich
Detaillierter Direktvergleich von EP4SGX70DF29C4G von Intel und EP4SGX110DF29C3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX70DF29C4G | EP4SGX110DF29C3G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $196,99 | $2.610,50 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV | Stratix IV GX |
| Logic Elements (LE) | 72,600 | — |
| Total Memory Bits | 7,564,880 | 9,793,536 |
| User I/O Count | 372 | 372 |
| Number of Transceivers | 8 | — |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| Package Type | 780-BBGA, FCBGA | 780-BBGA, FCBGA (Flip-Chip) |
| Package Code | BGA | — |
| Package Body Size | 29 mm × 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Process Node | 40 nm | — |
| Speed Grade | C4 (commercial) | — |
| Betriebstemperatur | [DATA_NEEDED: Operating Temperature Range] | Commercial (0C to +85C) - per C3 grade suffix |
| Montageart | Surface Mount | Surface Mount (Flip-Chip BGA) |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements | — | 105,600 |
| Adaptive Logic Modules (ALMs) | — | 4,224 LABs |
| Package Pin/Ball Count | — | 780 |
| Versorgungsspannung | — | 0.9 V core |
| Process Technology | — | 40 nm |
| Transceiver Data Rate | — | Up to 8.5 Gbps |
| Transceiver Count | — | [DATA_NEEDED: number of transceivers] |
| DSP Blocks | — | 266 (18x18 multipliers) |