EP4SGX70DF29C4G vs EP4SGX110DF29C3G Comparación
Comparación detallada lado a lado de EP4SGX70DF29C4G por Intel y EP4SGX110DF29C3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX70DF29C4G | EP4SGX110DF29C3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $196,99 | $2.610,50 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV | Stratix IV GX |
| Logic Elements (LE) | 72,600 | — |
| Total Memory Bits | 7,564,880 | 9,793,536 |
| User I/O Count | 372 | 372 |
| Number of Transceivers | 8 | — |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| Package Type | 780-BBGA, FCBGA | 780-BBGA, FCBGA (Flip-Chip) |
| Package Code | BGA | — |
| Package Body Size | 29 mm × 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Process Node | 40 nm | — |
| Speed Grade | C4 (commercial) | — |
| Temperatura de funcionamiento | [DATA_NEEDED: Operating Temperature Range] | Commercial (0C to +85C) - per C3 grade suffix |
| Tipo de montaje | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements | — | 105,600 |
| Adaptive Logic Modules (ALMs) | — | 4,224 LABs |
| Package Pin/Ball Count | — | 780 |
| Tensión de alimentación | — | 0.9 V core |
| Process Technology | — | 40 nm |
| Transceiver Data Rate | — | Up to 8.5 Gbps |
| Transceiver Count | — | [DATA_NEEDED: number of transceivers] |
| DSP Blocks | — | 266 (18x18 multipliers) |