EP4SGX70DF29I3G vs EP4SGX70DF29C2XG Vergleich

Detaillierter Direktvergleich von EP4SGX70DF29I3G von Intel und EP4SGX70DF29C2XG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP4SGX70DF29I3G EP4SGX70DF29C2XG
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.080,00 $1.295,00
Series Stratix IV GX —
Process Technology 40 nm 40 nm
Logic Elements (LE) 72,600 72,600
Embedded Memory Bits 7,564,880 (about 7.5 Mbit) —
Embedded Memory Blocks 72600 —
Number of Logic Cells / Arrays 372 —
Number of User I/O Pins 372 —
Number of Transceiver Channels [DATA_NEEDED: exact channel count for this device] —
Transceiver Data Rate [DATA_NEEDED: per-channel data rate] —
Package Type 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) —
Package Code DF29 —
Operating Temperature Grade Industrial (I3) —
Junction Temperature Range -40C to +100C —
Core Supply Voltage 0.87 V to 0.93 V —
Speed Grade -3 —
Montageart Surface Mount (BGA) Surface Mount
MSL-Level [DATA_NEEDED: MSL rating] 3 (168 hours)
RoHS-Status Compliant Compliant
Halogenfrei [DATA_NEEDED: halogen-free claim] —
Family — Stratix IV GX
Embedded Memory — 7,564,880 bits
Maximum User I/O — 372
Core Voltage — 0.9 V
Gehäuse — 780-FBGA (29x29 mm)
Transceiver Speed — Up to 8.5 Gbps
Transceiver Count — [DATA_NEEDED: number of transceiver channels]
DSP Blocks (18x18 Multipliers) — 364
Betriebstemperaturbereich — -40C to +85C (commercial)
Lead-Free — Yes
Tray Packaging — Yes

Datenblätter & Ressourcen

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