EP4SGX70HF35I3G vs EP4SGX110HF35I3G Vergleich
Detaillierter Direktvergleich von EP4SGX70HF35I3G von Intel und EP4SGX110HF35I3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX70HF35I3G | EP4SGX110HF35I3G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.250,00 | $7.900,00 |
| Series | Stratix IV GX | — |
| Logic Elements | 72,600 LE | 105,600 |
| Adaptive Logic Modules (ALMs) | 29,040 ALM | — |
| Embedded Memory | 7.20 Mbit (7,564,880 bits) | — |
| User I/Os | 480 | — |
| Transceivers | 9 channels up to 8.5 Gbps (GX) | — |
| 18x18 Multipliers | 488 | — |
| PLLs | 4 per quadrant | — |
| Process Technology | 40 nm TSMC | 40 nm low-power CMOS |
| Core Supply Voltage | 950 mV | — |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Speed Grade | I3 | — |
| Gehäuse | 1152-ball FCBGA, 35x35 mm, 1.0 mm pitch | 1152-ball FC-FBGA (HF35), 35 x 35 mm, 1.0 mm pitch |
| Montageart | Surface Mount (Flip-Chip BGA) | Surface Mount (Flip-Chip BGA) |
| Packaging | Tray | — |
| Embedded Memory Bits | — | 9,793,536 (9.4 Mbit) |
| Maximum User I/O Pins | — | 488 |
| Multipliers (18x18) | — | 352 |
| Core Supply Voltage (nominal) | — | 0.9 V |
| Family | — | Stratix IV GX |
| Speed/Grade | — | I3 (Industrial, -3 speed) |
| Betriebs-Sperrschichttemperatur | — | -40 C to +100 C |
| Multi-Gigabit Transceivers | — | 8 channels (3.125 Gbps to 8.5 Gbps per family datasheet) |
| Hard IP Blocks | — | PCIe Gen1/Gen2, external memory PHY |
| MSL-Level | — | [DATA_NEEDED: MSL level] |
| RoHS-Status | — | Compliant |
| Lead-Free / Halogen-Free | — | Lead-free |
| Configuration Memory | — | SRAM-based (volatile, requires configuration device) |