EP4SGX70HF35I3G vs EP4SGX110HF35I3G Comparación
Comparación detallada lado a lado de EP4SGX70HF35I3G por Intel y EP4SGX110HF35I3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX70HF35I3G | EP4SGX110HF35I3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.250,00 | $7.900,00 |
| Series | Stratix IV GX | — |
| Logic Elements | 72,600 LE | 105,600 |
| Adaptive Logic Modules (ALMs) | 29,040 ALM | — |
| Embedded Memory | 7.20 Mbit (7,564,880 bits) | — |
| User I/Os | 480 | — |
| Transceivers | 9 channels up to 8.5 Gbps (GX) | — |
| 18x18 Multipliers | 488 | — |
| PLLs | 4 per quadrant | — |
| Process Technology | 40 nm TSMC | 40 nm low-power CMOS |
| Core Supply Voltage | 950 mV | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Speed Grade | I3 | — |
| Encapsulado | 1152-ball FCBGA, 35x35 mm, 1.0 mm pitch | 1152-ball FC-FBGA (HF35), 35 x 35 mm, 1.0 mm pitch |
| Tipo de montaje | Surface Mount (Flip-Chip BGA) | Surface Mount (Flip-Chip BGA) |
| Packaging | Tray | — |
| Embedded Memory Bits | — | 9,793,536 (9.4 Mbit) |
| Maximum User I/O Pins | — | 488 |
| Multipliers (18x18) | — | 352 |
| Core Supply Voltage (nominal) | — | 0.9 V |
| Family | — | Stratix IV GX |
| Speed/Grade | — | I3 (Industrial, -3 speed) |
| Temperatura de unión de funcionamiento | — | -40 C to +100 C |
| Multi-Gigabit Transceivers | — | 8 channels (3.125 Gbps to 8.5 Gbps per family datasheet) |
| Hard IP Blocks | — | PCIe Gen1/Gen2, external memory PHY |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Estado RoHS | — | Compliant |
| Lead-Free / Halogen-Free | — | Lead-free |
| Configuration Memory | — | SRAM-based (volatile, requires configuration device) |