EPF10K100BFC256-3 vs EPF10K100EFC256-2X Vergleich

Detaillierter Direktvergleich von EPF10K100BFC256-3 von Intel und EPF10K100EFC256-2X von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K100BFC256-3 EPF10K100EFC256-2X
Marke Intel Altera
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $58,20 $30,50
Family FLEX 10KE FLEX 10KE
Typical Gates 100,000 —
Logic Elements (LEs) 4,992 —
Embedded Array Blocks (EABs) 12 —
Total RAM Bits 24,576 49,152
Maximum Operating Frequency 200 MHz —
Process Technology 0.22 µm CMOS SRAM —
Core Supply Voltage 2.5 V (range 2.3 V to 2.7 V) —
Speed Grade -3 -2
Gehäuse 256-pin FineLine BGA (FBGA) —
User I/O Pins (max) [DATA_NEEDED: exact user I/O count for BFC256 package] —
Betriebstemperaturbereich 0 °C to 70 °C —
Configuration Method SRAM, requires external config device —
JTAG Boundary Scan IEEE Std. 1149.1-1990 compliant —
PCI Compliance PCI Local Bus Spec Rev. 2.2 (3.3 V, -3 speed grade) —
Montageart Surface Mount (BGA) Surface Mount
MSL-Level [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL moisture sensitivity level]
RoHS-Status [DATA_NEEDED: RoHS status] —
Series — FLEX-10KE
Logic Elements / Cells — 49,152
Number of LABs/CLBs — 624
Number of Logic Elements/Cells — 4,992
Number of I/O — 191
Number of Gates — 100,000
Voltage - Supply — 2.375V to 2.625V (core), 3.0V to 3.6V (I/O)
Betriebstemperatur — 0°C to 70°C
Gehäuse / Bauform — 256-FBGA (FineLine BGA, 17x17 mm)
Supplier Device Package — 256-BGA
Logic Family — CMOS (SRAM-based)
Propagation Delay — 0.6 ns (per EAB)
Configuration Interface — JTAG / Passive Serial / Active Serial
Lead-Free / RoHS Status — Depends on date code - verify with distributor

Datenblätter & Ressourcen

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