EPF10K100BFC256-3 vs EPF10K100EFC256-2X Comparaison
Comparaison détaillée côte à côte de EPF10K100BFC256-3 par Intel et EPF10K100EFC256-2X par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Altera
EPF10K100EFC256-2X - FLEX 10KE FPGA, 49,152 Gates, 256-BGA | Altera
EPF10K100EFC256-2X ObsoleteComparaison des spécifications
| Paramètre | EPF10K100BFC256-3 | EPF10K100EFC256-2X |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $58,20 | $30,50 |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gates | 100,000 | — |
| Logic Elements (LEs) | 4,992 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 24,576 | 49,152 |
| Maximum Operating Frequency | 200 MHz | — |
| Process Technology | 0.22 µm CMOS SRAM | — |
| Core Supply Voltage | 2.5 V (range 2.3 V to 2.7 V) | — |
| Speed Grade | -3 | -2 |
| Boîtier | 256-pin FineLine BGA (FBGA) | — |
| User I/O Pins (max) | [DATA_NEEDED: exact user I/O count for BFC256 package] | — |
| Plage de température de fonctionnement | 0 °C to 70 °C | — |
| Configuration Method | SRAM, requires external config device | — |
| JTAG Boundary Scan | IEEE Std. 1149.1-1990 compliant | — |
| PCI Compliance | PCI Local Bus Spec Rev. 2.2 (3.3 V, -3 speed grade) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Niveau MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL moisture sensitivity level] |
| Statut RoHS | [DATA_NEEDED: RoHS status] | — |
| Series | — | FLEX-10KE |
| Logic Elements / Cells | — | 49,152 |
| Number of LABs/CLBs | — | 624 |
| Number of Logic Elements/Cells | — | 4,992 |
| Number of I/O | — | 191 |
| Number of Gates | — | 100,000 |
| Voltage - Supply | — | 2.375V to 2.625V (core), 3.0V to 3.6V (I/O) |
| Température de fonctionnement | — | 0°C to 70°C |
| Boîtier / Format | — | 256-FBGA (FineLine BGA, 17x17 mm) |
| Supplier Device Package | — | 256-BGA |
| Logic Family | — | CMOS (SRAM-based) |
| Propagation Delay | — | 0.6 ns (per EAB) |
| Configuration Interface | — | JTAG / Passive Serial / Active Serial |
| Lead-Free / RoHS Status | — | Depends on date code - verify with distributor |