EPF10K100EBC356-2 vs EPF10K200SBC356-2X Vergleich

Detaillierter Direktvergleich von EPF10K100EBC356-2 von Intel und EPF10K200SBC356-2X von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K100EBC356-2 EPF10K200SBC356-2X
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $59,95 $295,00
Series FLEX-10KE FLEX-10KS
Family Embedded Programmable Logic Device (PLD) FLEX 10K
Typical Gates 100,000 —
Maximum System Gates 158,000 —
Logic Elements (LEs) 4,992 —
Number of LABs/CLBs 624 —
Embedded Array Blocks (EABs) 12 —
Total RAM Bits 49,152 —
User I/O Pins 274 —
Supply Voltage (Core) 2.375 V to 2.625 V (2.5 V nominal) —
Propagation Delay (tPD) 0.5 ns —
Internal Operating Frequency up to 250 MHz —
Process Technology CMOS, SRAM-based CMOS 0.22 µm
Package Type 356-LBGA (35 x 35 mm, 1.27 mm pitch) —
Betriebstemperatur 0 C to 70 C (Commercial) 0 °C to +70 °C (commercial)
Montageart Surface Mount Surface Mount
Configuration Method SRAM, JTAG (IEEE 1149.1) SRAM-based, requires external configuration device (EPC2/EPC8)
Speed Grade -2 -2
RoHS-Status [DATA_NEEDED: RoHS compliance] —
Lead-Free [DATA_NEEDED: lead-free status] —
Logic Elements / Cells — 9984
Approximate Gate Count — 200,000
Logic Array Blocks (LABs) — 1248
User I/O Count — 274
Gehäuse — 356-LBGA (35x35 mm, 1.27 mm pitch)
Versorgungsspannung — 2.375 V to 2.625 V (core)
Propagation Delay (typ.) — 0.4 ns
Lead Free Status / RoHS — RoHS non-compliant (per third-party listing)
In-System Programmability — Yes (via JTAG or serial interface)

Datenblätter & Ressourcen

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