EPF10K100EBC356-2 vs EPF10K200SBC356-2X 对比
详细并排对比 EPF10K100EBC356-2 出自 Intel 和 EPF10K200SBC356-2X 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EPF10K100EBC356-2 - 100K Gates FLEX 10KE FPGA 274 I/O BGA-356 | Intel
EPF10K100EBC356-2 ObsoleteIntel
EPF10K200SBC356-2X - FLEX 10K 200K Gates FPGA, 274 I/O, 356-BGA | Intel/Altera
EPF10K200SBC356-2X Nrnd规格对比
| 参数 | EPF10K100EBC356-2 | EPF10K200SBC356-2X |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $59.95 | $295.00 |
| Series | FLEX-10KE | FLEX-10KS |
| Family | Embedded Programmable Logic Device (PLD) | FLEX 10K |
| Typical Gates | 100,000 | — |
| Maximum System Gates | 158,000 | — |
| Logic Elements (LEs) | 4,992 | — |
| Number of LABs/CLBs | 624 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 49,152 | — |
| User I/O Pins | 274 | — |
| Supply Voltage (Core) | 2.375 V to 2.625 V (2.5 V nominal) | — |
| Propagation Delay (tPD) | 0.5 ns | — |
| Internal Operating Frequency | up to 250 MHz | — |
| Process Technology | CMOS, SRAM-based | CMOS 0.22 µm |
| Package Type | 356-LBGA (35 x 35 mm, 1.27 mm pitch) | — |
| 工作温度 | 0 C to 70 C (Commercial) | 0 °C to +70 °C (commercial) |
| 安装类型 | Surface Mount | Surface Mount |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) | SRAM-based, requires external configuration device (EPC2/EPC8) |
| Speed Grade | -2 | -2 |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements / Cells | — | 9984 |
| Approximate Gate Count | — | 200,000 |
| Logic Array Blocks (LABs) | — | 1248 |
| User I/O Count | — | 274 |
| 封装 | — | 356-LBGA (35x35 mm, 1.27 mm pitch) |
| 电源电压 | — | 2.375 V to 2.625 V (core) |
| Propagation Delay (typ.) | — | 0.4 ns |
| Lead Free Status / RoHS | — | RoHS non-compliant (per third-party listing) |
| In-System Programmability | — | Yes (via JTAG or serial interface) |