EPF10K130EFC484-3N vs EPF10K100EFC484-3N Vergleich

Detaillierter Direktvergleich von EPF10K130EFC484-3N von Intel und EPF10K100EFC484-3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K130EFC484-3N EPF10K100EFC484-3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $109,25 $142,00
Series FLEX-10KE —
Number of Logic Elements / Cells 6656 —
Total RAM Bits 65536 —
Typical Gate Count 130000 —
Number of I/O 369 —
Number of LABs/CLBs 832 —
Number of Embedded Array Blocks (EABs) 72 —
Speed Grade -3 (faster timing bin) -3 (fastest commercial bin)
Operating Temperature Grade Commercial (0C to +70C) —
Core Voltage 2.5 V —
Process Technology 0.22 µm CMOS 0.22 µm CMOS
Package Type 484-BBGA (FineLine BGA) —
Package Dimensions 23 x 23 mm —
Ball Pitch 1.0 mm —
Montageart Surface Mount Surface Mount (BGA)
Configuration Memory SRAM-based (volatile, requires config device) —
RoHS-Status [DATA_NEEDED: RoHS status] —
Configuration Interface JTAG / PS / PPS / Altera serial —
Family — FLEX 10KE
Logic Elements / Cells — 4992
Total Gates — 100,000
Embedded Memory (EAB) — 49,152 bits (12 EABs)
Logic Array Blocks (LABs) — 624
User I/Os — 338
Core Voltage (VCCINT) — 2.5 V
I/O Voltage (VCCIO) — MultiVolt (2.5 V / 3.3 V / 5.0 V tolerant per bank)
Internal Performance — 200 MHz
Gehäuse — 484-ball FineLine BGA (FC484 / FBGA-484)
Temperature Grade — Commercial (0 °C to +70 °C)
Configuration Method — SRAM (external EPROM/Flash/JTAG required at power-up)
Lead-Free / RoHS — Yes (N suffix = lead-free)

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