EPF10K130EFC484-3N vs EPF10K100EFC484-3N 对比
详细并排对比 EPF10K130EFC484-3N 出自 Intel 和 EPF10K100EFC484-3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPF10K130EFC484-3N | EPF10K100EFC484-3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $109.25 | $142.00 |
| Series | FLEX-10KE | — |
| Number of Logic Elements / Cells | 6656 | — |
| Total RAM Bits | 65536 | — |
| Typical Gate Count | 130000 | — |
| Number of I/O | 369 | — |
| Number of LABs/CLBs | 832 | — |
| Number of Embedded Array Blocks (EABs) | 72 | — |
| Speed Grade | -3 (faster timing bin) | -3 (fastest commercial bin) |
| Operating Temperature Grade | Commercial (0C to +70C) | — |
| Core Voltage | 2.5 V | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Package Type | 484-BBGA (FineLine BGA) | — |
| Package Dimensions | 23 x 23 mm | — |
| Ball Pitch | 1.0 mm | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| Configuration Memory | SRAM-based (volatile, requires config device) | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | — |
| Configuration Interface | JTAG / PS / PPS / Altera serial | — |
| Family | — | FLEX 10KE |
| Logic Elements / Cells | — | 4992 |
| Total Gates | — | 100,000 |
| Embedded Memory (EAB) | — | 49,152 bits (12 EABs) |
| Logic Array Blocks (LABs) | — | 624 |
| User I/Os | — | 338 |
| Core Voltage (VCCINT) | — | 2.5 V |
| I/O Voltage (VCCIO) | — | MultiVolt (2.5 V / 3.3 V / 5.0 V tolerant per bank) |
| Internal Performance | — | 200 MHz |
| 封装 | — | 484-ball FineLine BGA (FC484 / FBGA-484) |
| Temperature Grade | — | Commercial (0 °C to +70 °C) |
| Configuration Method | — | SRAM (external EPROM/Flash/JTAG required at power-up) |
| Lead-Free / RoHS | — | Yes (N suffix = lead-free) |