EPF10K200EBC600-3 vs EPF10K200EBC600-2 Vergleich
Detaillierter Direktvergleich von EPF10K200EBC600-3 von Intel und EPF10K200EBC600-2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 Obsolete
Spezifikationsvergleich
| Parameter | EPF10K200EBC600-3 | EPF10K200EBC600-2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $575,00 | $198,00 |
| Family | FLEX 10KE | — |
| Series | FLEX-10KE | FLEX-10KE |
| System Gates | 200,000 | — |
| Logic Elements / Cells | 9,984 | — |
| Logic Array Blocks (LABs) | 1248 | 1248 |
| Embedded Memory (EABs) | 24,576 bits | — |
| Maximum User I/O | 470 | 470 pins |
| Number of PLLs | 4 | — |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| Process Technology | 0.22 micrometer SRAM | 0.30 µm CMOS |
| Speed Grade | -3 (commercial) | — |
| Gehäuse | 600-ball FineLine BGA, 45 x 45 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0C to +70C (commercial) | 0°C to +70°C (Commercial) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | unknown |
| Logic Family | — | CMOS (SRAM-based) |
| Typical Gate Count | — | 200,000 gates |
| Logic Elements (LEs) | — | 9984 |
| Embedded Memory (EAB) | — | 98304 bits (96 Kbits) |
| Propagation Delay | — | 0.4 ns |
| Versorgungsspannung | — | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) |
| I/O Standards | — | LVTTL, LVCMOS, PCI, GTL+ |
| Package Type | — | 600-ball BGA (BGA-600) |
| Package Dimensions | — | 45 × 45 mm |
| Ball Pitch | — | 1.27 mm |
| Package Height | — | 1.1 mm max |
| Configuration Method | — | JTAG (IEEE 1149.1), EPC2 serial PROM |
| Part Status | — | Obsolete |