EPF10K200EBI600-2 vs EPF10K200EBI600-2N Vergleich
Detaillierter Direktvergleich von EPF10K200EBI600-2 von Intel und EPF10K200EBI600-2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 ObsoleteSpezifikationsvergleich
| Parameter | EPF10K200EBI600-2 | EPF10K200EBI600-2N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $198,00 | $140,00 |
| Family | FLEX 10KE | FLEX 10KE |
| System Gates | 200,000 | — |
| Logic Elements (LEs) | 9,984 | 9,984 |
| Logic Array Blocks (LABs) | 1,248 | — |
| Embedded RAM | 98,304 bits | — |
| Embedded Array Blocks (EABs) | 12 (typical for this density) | 12 |
| User I/O Pins | 470 | 470 |
| Supply Voltage (VCCINT) | 2.5 V | — |
| Propagation Delay | 0.4 ns (per -2 speed grade) | 0.4 ns to 0.6 ns (per LE) |
| Betriebstemperatur | 0 C to 70 C (commercial) | 0 °C to +70 °C (commercial) |
| Gehäuse | BGA-600, 45 x 45 mm, 1.27 mm pitch | 600-ball BGA (45 mm x 45 mm, 1.27 mm pitch) |
| Logic Family | CMOS, SRAM-based | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Method | JTAG / ByteBlaster (SRAM configuration) | SRAM, JTAG (IEEE 1149.1), serial configuration EPROM |
| RoHS-Status | Compliant (lead-free package) | [DATA_NEEDED: RoHS compliance status] |
| Typical Gates | — | 200,000 |
| Maximum System Gates | — | 513,000 |
| Total RAM Bits | — | 98,304 |
| Dedicated Inputs | — | 6 |
| Technology / Process | — | 0.22 µm CMOS SRAM |
| Core Supply Voltage | — | 2.5 V (2.3 V to 2.7 V) |
| I/O Supply Voltage | — | 2.5 V / 3.3 V (5 V tolerant I/O available) |
| Maximum Internal Frequency | — | 200 MHz |
| MSL-Level | — | [DATA_NEEDED: moisture sensitivity level] |