EPF10K200EBI600-2N vs EPF10K200EBC600-3 Vergleich

Detaillierter Direktvergleich von EPF10K200EBI600-2N von Intel und EPF10K200EBC600-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EPF10K200EBI600-2N EPF10K200EBI600-2N - 200K Gates FLEX 10KE FPGA | Intel

EPF10K200EBI600-2N - 200K Gates FLEX 10KE FPGA | Intel

EPF10K200EBI600-2N Obsolete

Spezifikationsvergleich

Parameter EPF10K200EBI600-2N EPF10K200EBC600-3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $140,00 $575,00
Family FLEX 10KE FLEX 10KE
Typical Gates 200,000 —
Maximum System Gates 513,000 —
Logic Elements (LEs) 9,984 —
Embedded Array Blocks (EABs) 12 —
Total RAM Bits 98,304 —
User I/O Pins 470 —
Dedicated Inputs 6 —
Gehäuse 600-ball BGA (45 mm x 45 mm, 1.27 mm pitch) 600-ball FineLine BGA, 45 x 45 mm
Technology / Process 0.22 µm CMOS SRAM —
Core Supply Voltage 2.5 V (2.3 V to 2.7 V) —
I/O Supply Voltage 2.5 V / 3.3 V (5 V tolerant I/O available) —
Propagation Delay 0.4 ns to 0.6 ns (per LE) —
Maximum Internal Frequency 200 MHz —
Betriebstemperatur 0 °C to +70 °C (commercial) 0C to +70C (commercial)
Configuration Method SRAM, JTAG (IEEE 1149.1), serial configuration EPROM —
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
RoHS-Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance status]
Montageart Surface Mount (BGA) Surface Mount
Series — FLEX-10KE
System Gates — 200,000
Logic Elements / Cells — 9,984
Logic Array Blocks (LABs) — 1248
Embedded Memory (EABs) — 24,576 bits
Maximum User I/O — 470
Number of PLLs — 4
Core Voltage — 2.5 V (2.375 V to 2.625 V)
Process Technology — 0.22 micrometer SRAM
Speed Grade — -3 (commercial)
JTAG Support — Yes (IEEE 1149.1 boundary-scan)

Datenblätter & Ressourcen

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