EPF10K200EFC672-3 vs EPF10K250EFC672-1 Vergleich

Detaillierter Direktvergleich von EPF10K200EFC672-3 von Intel und EPF10K250EFC672-1 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K200EFC672-3 EPF10K250EFC672-1
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $115,00 $115,00
Series FLEX 10KE —
Number of Logic Elements / Cells 9,984 —
Number of LABs / CLBs 1248 —
Total RAM Bits 98,304 bits (12 EABs of 8 Kbits) —
Number of I/O 470 —
Number of Gates (typical) 200,000 —
Supply Voltage - Operating 2.3 V to 2.7 V (2.5 V nominal) —
Process Technology 0.22 µm CMOS —
Maximum Operating Frequency 166.67 MHz —
Propagation Delay 0.4 ns 0.4 ns
Gehäuse / Bauform 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) —
Montageart Surface Mount Surface Mount
Betriebstemperatur 0 °C to +70 °C (commercial) 0C to +70C (Commercial)
Configuration Memory SRAM-based (volatile, requires external configuration device) —
Number of PLLs 4 —
RoHS-Status [DATA_NEEDED: rohs status] [DATA_NEEDED: RoHS status]
MSL-Level [DATA_NEEDED: MSL level] —
Lead-Free [DATA_NEEDED: lead-free status] —
Family — FLEX 10KE
Logic Family — CMOS
Typical System Gates — 250,000
Maximum User I/Os — 470
Total Pins — 672
Package Type — BGA-672
Package Size — 45 x 45 mm
Ball Pitch — 1.27 mm
Package Shape — Square
Terminal Form — Ball
Programming Technology — In-system, SRAM-based
Configuration Interface — Serial (passive/active)
Speed Grade — -1

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