EPF10K200EGC599-1 vs EPF10K200EFC672-3 Vergleich
Detaillierter Direktvergleich von EPF10K200EGC599-1 von Intel und EPF10K200EFC672-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
EPF10K200EGC599-1 ⚠ Letzte BestellmöglichkeitIntel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 ObsoleteSpezifikationsvergleich
| Parameter | EPF10K200EGC599-1 | EPF10K200EFC672-3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $880,00 | $115,00 |
| Family | FLEX 10KE | — |
| Logic Elements (LEs) | 9,984 | — |
| Typical Gates | 200,000 | — |
| Embedded Array Blocks (EABs) | 470 | — |
| Total RAM Bits | 98,304 | 98,304 bits (12 EABs of 8 Kbits) |
| Core Supply Voltage | 2.375 V to 2.625 V | — |
| I/O Voltage Tolerance | 5.0 V tolerant | — |
| Pin-Anzahl | 599 | — |
| Package Type | 599-BCPGA (Ceramic Pin Grid Array) | — |
| Package Dimensions | 62.48 x 62.48 mm | — |
| Montageart | Through-Hole (Socket or Solder) | Surface Mount |
| Betriebstemperatur | 0C to +70C (Commercial) | 0 °C to +70 °C (commercial) |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| PLLs | 4 | — |
| RoHS-Status | [DATA_NEEDED: RoHS status of ceramic CPGA variant] | [DATA_NEEDED: rohs status] |
| Series | — | FLEX 10KE |
| Number of Logic Elements / Cells | — | 9,984 |
| Number of LABs / CLBs | — | 1248 |
| Number of I/O | — | 470 |
| Number of Gates (typical) | — | 200,000 |
| Supply Voltage - Operating | — | 2.3 V to 2.7 V (2.5 V nominal) |
| Process Technology | — | 0.22 µm CMOS |
| Maximum Operating Frequency | — | 166.67 MHz |
| Propagation Delay | — | 0.4 ns |
| Gehäuse / Bauform | — | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) |
| Configuration Memory | — | SRAM-based (volatile, requires external configuration device) |
| Number of PLLs | — | 4 |
| MSL-Level | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |