EPF10K200EGC599-1 vs EPF10K200EFC672-3 对比
详细并排对比 EPF10K200EGC599-1 出自 Intel 和 EPF10K200EFC672-3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
EPF10K200EGC599-1 ⚠ 最后一次采购Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 Obsolete规格对比
| 参数 | EPF10K200EGC599-1 | EPF10K200EFC672-3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $880.00 | $115.00 |
| Family | FLEX 10KE | — |
| Logic Elements (LEs) | 9,984 | — |
| Typical Gates | 200,000 | — |
| Embedded Array Blocks (EABs) | 470 | — |
| Total RAM Bits | 98,304 | 98,304 bits (12 EABs of 8 Kbits) |
| Core Supply Voltage | 2.375 V to 2.625 V | — |
| I/O Voltage Tolerance | 5.0 V tolerant | — |
| 引脚数量 | 599 | — |
| Package Type | 599-BCPGA (Ceramic Pin Grid Array) | — |
| Package Dimensions | 62.48 x 62.48 mm | — |
| 安装类型 | Through-Hole (Socket or Solder) | Surface Mount |
| 工作温度 | 0C to +70C (Commercial) | 0 °C to +70 °C (commercial) |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| PLLs | 4 | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status of ceramic CPGA variant] | [DATA_NEEDED: rohs status] |
| Series | — | FLEX 10KE |
| Number of Logic Elements / Cells | — | 9,984 |
| Number of LABs / CLBs | — | 1248 |
| Number of I/O | — | 470 |
| Number of Gates (typical) | — | 200,000 |
| Supply Voltage - Operating | — | 2.3 V to 2.7 V (2.5 V nominal) |
| Process Technology | — | 0.22 µm CMOS |
| Maximum Operating Frequency | — | 166.67 MHz |
| Propagation Delay | — | 0.4 ns |
| 封装 / 外壳 | — | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) |
| Configuration Memory | — | SRAM-based (volatile, requires external configuration device) |
| Number of PLLs | — | 4 |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |