EPF10K200EGC599-1 vs EPF10K200EFC672-3 비교
다음의 상세 나란히 비교: EPF10K200EGC599-1 제조: Intel 및 EPF10K200EFC672-3 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Intel
EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
EPF10K200EGC599-1 ⚠ 최종 구매Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 Obsolete사양 비교
| 파라미터 | EPF10K200EGC599-1 | EPF10K200EFC672-3 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 최종 구매 | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $880.00 | $115.00 |
| Family | FLEX 10KE | — |
| Logic Elements (LEs) | 9,984 | — |
| Typical Gates | 200,000 | — |
| Embedded Array Blocks (EABs) | 470 | — |
| Total RAM Bits | 98,304 | 98,304 bits (12 EABs of 8 Kbits) |
| Core Supply Voltage | 2.375 V to 2.625 V | — |
| I/O Voltage Tolerance | 5.0 V tolerant | — |
| 핀 수 | 599 | — |
| Package Type | 599-BCPGA (Ceramic Pin Grid Array) | — |
| Package Dimensions | 62.48 x 62.48 mm | — |
| 실장 유형 | Through-Hole (Socket or Solder) | Surface Mount |
| 동작 온도 | 0C to +70C (Commercial) | 0 °C to +70 °C (commercial) |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| PLLs | 4 | — |
| RoHS 상태 | [DATA_NEEDED: RoHS status of ceramic CPGA variant] | [DATA_NEEDED: rohs status] |
| Series | — | FLEX 10KE |
| Number of Logic Elements / Cells | — | 9,984 |
| Number of LABs / CLBs | — | 1248 |
| Number of I/O | — | 470 |
| Number of Gates (typical) | — | 200,000 |
| Supply Voltage - Operating | — | 2.3 V to 2.7 V (2.5 V nominal) |
| Process Technology | — | 0.22 µm CMOS |
| Maximum Operating Frequency | — | 166.67 MHz |
| Propagation Delay | — | 0.4 ns |
| 패키지 / 케이스 | — | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) |
| Configuration Memory | — | SRAM-based (volatile, requires external configuration device) |
| Number of PLLs | — | 4 |
| MSL 레벨 | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |