EPF10K200SBC356-1 vs EPF10K200SBC356-3 Vergleich

Detaillierter Direktvergleich von EPF10K200SBC356-1 von Intel und EPF10K200SBC356-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K200SBC356-1 EPF10K200SBC356-3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $580,00 $87,50
Family FLEX 10K (Classic embedded array) FLEX 10K
Logic Elements / Cells 9,984 —
Number of LABs / CLBs 1,248 —
Total RAM Bits 98,304 —
Equivalent Gate Count 200,000 (system gates ~513,000) —
Number of User I/Os 274 —
Propagation Delay 0.4 ns (-1 speed grade) 0.4 ns
Core Supply Voltage 2.375 V to 2.625 V 2.375 V to 2.625 V
Betriebstemperatur 0 °C to 70 °C (commercial) 0 C to 70 C (Commercial)
Gehäuse 356-LBGA (35 x 35 mm, 1.27 mm pitch) PBGA-356 (35 x 35 mm, 1.27 mm pitch)
Montageart Surface Mount Surface Mount
Logic Family / Process CMOS SRAM LUT —
Configuration Method SRAM (volatile) - requires configuration device or JTAG —
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: rohs status]
MSL-Level [DATA_NEEDED: MSL level] —
Device Type — FPGA - Field Programmable Gate Array
Typical Gates — 200,000
Logic Elements (Cells) — 9,984
Logic Array Blocks (LABs) — 1,248
Embedded Array Blocks (EABs) — 12
Total EAB RAM — 98,304 bits
User I/Os — 470 (package exposes 274 bonded-out)
Flip-Flops — 4,992
Process Technology — 0.22 um CMOS, 4 metal layers
Internal Performance (fmax) — 250 MHz
Configuration Mode — Passive Serial / Passive Parallel / JTAG
MultiVolt I/O — 2.5 V / 3.3 V / 5.0 V
Logic Family — CMOS

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