EPF10K200SBC356-1 vs EPF10K200SBC356-3 比較
詳細な並列比較: EPF10K200SBC356-1 メーカー: Intel および EPF10K200SBC356-3 メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
Intel
EPF10K200SBC356-1 - 200K FLEX 10K FPGA, 274 I/O, 356-BGA | Intel / Altera
EPF10K200SBC356-1 Nrnd
仕様比較
| パラメータ | EPF10K200SBC356-1 | EPF10K200SBC356-3 |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | NRND | Obsolete |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $580.00 | $87.50 |
| Family | FLEX 10K (Classic embedded array) | FLEX 10K |
| Logic Elements / Cells | 9,984 | — |
| Number of LABs / CLBs | 1,248 | — |
| Total RAM Bits | 98,304 | — |
| Equivalent Gate Count | 200,000 (system gates ~513,000) | — |
| Number of User I/Os | 274 | — |
| Propagation Delay | 0.4 ns (-1 speed grade) | 0.4 ns |
| Core Supply Voltage | 2.375 V to 2.625 V | 2.375 V to 2.625 V |
| 動作温度 | 0 °C to 70 °C (commercial) | 0 C to 70 C (Commercial) |
| パッケージ | 356-LBGA (35 x 35 mm, 1.27 mm pitch) | PBGA-356 (35 x 35 mm, 1.27 mm pitch) |
| 実装タイプ | Surface Mount | Surface Mount |
| Logic Family / Process | CMOS SRAM LUT | — |
| Configuration Method | SRAM (volatile) - requires configuration device or JTAG | — |
| RoHS ステータス | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: rohs status] |
| MSLレベル | [DATA_NEEDED: MSL level] | — |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Typical Gates | — | 200,000 |
| Logic Elements (Cells) | — | 9,984 |
| Logic Array Blocks (LABs) | — | 1,248 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total EAB RAM | — | 98,304 bits |
| User I/Os | — | 470 (package exposes 274 bonded-out) |
| Flip-Flops | — | 4,992 |
| Process Technology | — | 0.22 um CMOS, 4 metal layers |
| Internal Performance (fmax) | — | 250 MHz |
| Configuration Mode | — | Passive Serial / Passive Parallel / JTAG |
| MultiVolt I/O | — | 2.5 V / 3.3 V / 5.0 V |
| Logic Family | — | CMOS |