EPF10K200SFC484-1 vs EPF10K130EFC484-3N Vergleich
Detaillierter Direktvergleich von EPF10K200SFC484-1 von Intel und EPF10K130EFC484-3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K200SFC484-1 | EPF10K130EFC484-3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $162,00 | $109,25 |
| Family | FLEX 10KS | — |
| Logic Cells | 9984 | — |
| System Gates | 200,000 | — |
| Embedded RAM Bits | 98,304 | — |
| Number of LABs/CLBs | 1248 | 832 |
| Number of Logic Elements | 9984 | — |
| Total RAM Bits | 98304 | 65536 |
| User I/O Count | 369 | — |
| Number of DLLs | 4 | — |
| Betriebstemperaturbereich | 0C to 70C (commercial) | — |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | 2.5 V |
| Process Technology | 0.22 um CMOS | 0.22 µm CMOS |
| Internal Operating Frequency | 250 MHz | — |
| Gehäuse | 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch | — |
| Montageart | Surface Mount | Surface Mount |
| Speed Grade | -1 (slowest of -1/-2/-3) | -3 (faster timing bin) |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, AGP | — |
| Series | — | FLEX-10KE |
| Number of Logic Elements / Cells | — | 6656 |
| Typical Gate Count | — | 130000 |
| Number of I/O | — | 369 |
| Number of Embedded Array Blocks (EABs) | — | 72 |
| Operating Temperature Grade | — | Commercial (0C to +70C) |
| Package Type | — | 484-BBGA (FineLine BGA) |
| Package Dimensions | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Configuration Memory | — | SRAM-based (volatile, requires config device) |
| Configuration Interface | — | JTAG / PS / PPS / Altera serial |