EPF10K200SFC484-1 vs EPF10K130EFC484-3N Comparación
Comparación detallada lado a lado de EPF10K200SFC484-1 por Intel y EPF10K130EFC484-3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K200SFC484-1 | EPF10K130EFC484-3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $162,00 | $109,25 |
| Family | FLEX 10KS | — |
| Logic Cells | 9984 | — |
| System Gates | 200,000 | — |
| Embedded RAM Bits | 98,304 | — |
| Number of LABs/CLBs | 1248 | 832 |
| Number of Logic Elements | 9984 | — |
| Total RAM Bits | 98304 | 65536 |
| User I/O Count | 369 | — |
| Number of DLLs | 4 | — |
| Rango de temperatura de funcionamiento | 0C to 70C (commercial) | — |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | 2.5 V |
| Process Technology | 0.22 um CMOS | 0.22 µm CMOS |
| Internal Operating Frequency | 250 MHz | — |
| Encapsulado | 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Speed Grade | -1 (slowest of -1/-2/-3) | -3 (faster timing bin) |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, AGP | — |
| Series | — | FLEX-10KE |
| Number of Logic Elements / Cells | — | 6656 |
| Typical Gate Count | — | 130000 |
| Number of I/O | — | 369 |
| Number of Embedded Array Blocks (EABs) | — | 72 |
| Operating Temperature Grade | — | Commercial (0C to +70C) |
| Package Type | — | 484-BBGA (FineLine BGA) |
| Package Dimensions | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Configuration Memory | — | SRAM-based (volatile, requires config device) |
| Configuration Interface | — | JTAG / PS / PPS / Altera serial |