EPF10K20TC144-3 vs EPF10K20TC144-4 Vergleich
Detaillierter Direktvergleich von EPF10K20TC144-3 von Intel und EPF10K20TC144-4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K20TC144-3 | EPF10K20TC144-4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $21,10 | $18,95 |
| Family | FLEX 10K | FLEX 10K |
| Logic Elements / Cells | 1,152 | 1,152 |
| Total RAM Bits | 24,576 | — |
| Number of Logic Array Blocks (LABs) | 144 | — |
| Number of Embedded Array Blocks (EABs) | 12 | — |
| Number of User I/O | 102 | — |
| Number of Gates | 20,000 | — |
| Maximum Operating Frequency | 125 MHz | 125 MHz |
| Propagation Delay | 0.4 ns | 0.4 ns (per logic element) |
| Versorgungsspannung | 5 V | 4.75 V to 5.25 V (5 V nominal) |
| Process Technology | 0.42 um CMOS | 0.42 um CMOS |
| Betriebstemperatur | 0 C to 70 C (Commercial) | 0C to 70C (commercial) |
| Gehäuse | 144-LQFP (TQFP) 22x22 mm | 144-LQFP (TQFP), 45 x 45 mm, 1.27 mm pitch |
| Montageart | Surface Mount (Gull Wing) | Surface Mount |
| Configuration Method | SRAM-based, serial configuration interface | — |
| Lead Pitch | 0.5 mm | — |
| RoHS-Status | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS compliance] |
| Typical Gates | — | 20,000 |
| Maximum Gates | — | 63,000 |
| Logic Array Blocks (LABs) | — | 144 |
| Embedded Memory (EAB) | — | 12,288 bits |
| User I/Os | — | 102 |
| Configuration Interface | — | Serial (BitBlaster/ByteBlaster) |
| Speed Grade | — | -4 |