EPF10K20TC144-3 vs EPF10K20TC144-4 Comparaison
Comparaison détaillée côte à côte de EPF10K20TC144-3 par Intel et EPF10K20TC144-4 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EPF10K20TC144-3 | EPF10K20TC144-4 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $21,10 | $18,95 |
| Family | FLEX 10K | FLEX 10K |
| Logic Elements / Cells | 1,152 | 1,152 |
| Total RAM Bits | 24,576 | — |
| Number of Logic Array Blocks (LABs) | 144 | — |
| Number of Embedded Array Blocks (EABs) | 12 | — |
| Number of User I/O | 102 | — |
| Number of Gates | 20,000 | — |
| Maximum Operating Frequency | 125 MHz | 125 MHz |
| Propagation Delay | 0.4 ns | 0.4 ns (per logic element) |
| Tension d'alimentation | 5 V | 4.75 V to 5.25 V (5 V nominal) |
| Process Technology | 0.42 um CMOS | 0.42 um CMOS |
| Température de fonctionnement | 0 C to 70 C (Commercial) | 0C to 70C (commercial) |
| Boîtier | 144-LQFP (TQFP) 22x22 mm | 144-LQFP (TQFP), 45 x 45 mm, 1.27 mm pitch |
| Type de montage | Surface Mount (Gull Wing) | Surface Mount |
| Configuration Method | SRAM-based, serial configuration interface | — |
| Lead Pitch | 0.5 mm | — |
| Statut RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS compliance] |
| Typical Gates | — | 20,000 |
| Maximum Gates | — | 63,000 |
| Logic Array Blocks (LABs) | — | 144 |
| Embedded Memory (EAB) | — | 12,288 bits |
| User I/Os | — | 102 |
| Configuration Interface | — | Serial (BitBlaster/ByteBlaster) |
| Speed Grade | — | -4 |