EPF10K20TC144-3 vs EPF10K20TC144-4 Comparación
Comparación detallada lado a lado de EPF10K20TC144-3 por Intel y EPF10K20TC144-4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K20TC144-3 | EPF10K20TC144-4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $21,10 | $18,95 |
| Family | FLEX 10K | FLEX 10K |
| Logic Elements / Cells | 1,152 | 1,152 |
| Total RAM Bits | 24,576 | — |
| Number of Logic Array Blocks (LABs) | 144 | — |
| Number of Embedded Array Blocks (EABs) | 12 | — |
| Number of User I/O | 102 | — |
| Number of Gates | 20,000 | — |
| Maximum Operating Frequency | 125 MHz | 125 MHz |
| Propagation Delay | 0.4 ns | 0.4 ns (per logic element) |
| Tensión de alimentación | 5 V | 4.75 V to 5.25 V (5 V nominal) |
| Process Technology | 0.42 um CMOS | 0.42 um CMOS |
| Temperatura de funcionamiento | 0 C to 70 C (Commercial) | 0C to 70C (commercial) |
| Encapsulado | 144-LQFP (TQFP) 22x22 mm | 144-LQFP (TQFP), 45 x 45 mm, 1.27 mm pitch |
| Tipo de montaje | Surface Mount (Gull Wing) | Surface Mount |
| Configuration Method | SRAM-based, serial configuration interface | — |
| Lead Pitch | 0.5 mm | — |
| Estado RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS compliance] |
| Typical Gates | — | 20,000 |
| Maximum Gates | — | 63,000 |
| Logic Array Blocks (LABs) | — | 144 |
| Embedded Memory (EAB) | — | 12,288 bits |
| User I/Os | — | 102 |
| Configuration Interface | — | Serial (BitBlaster/ByteBlaster) |
| Speed Grade | — | -4 |