EPF10K250EBC600-3 vs EPF10K250EFC672-3 Vergleich
Detaillierter Direktvergleich von EPF10K250EBC600-3 von Intel und EPF10K250EFC672-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K250EBC600-3 | EPF10K250EFC672-3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $205,00 | $99,50 |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 12,160 LEs | — |
| Typical Gates | 250,000 | — |
| Maximum User I/O | 470 | — |
| Embedded Array Blocks (EABs) | 12 (each 2 Kbits) | — |
| Total Embedded Memory | 24 Kbits (RAM) | — |
| PLLs (Phase-Locked Loops) | 4 | — |
| Dedicated Clock Inputs | 6 | — |
| Speed Grade | -3 | -3 (fastest) |
| Core Supply Voltage | 3.3 V | 2.5 V |
| I/O Supply Voltage | 3.3 V (5 V tolerant) | MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Gehäuse | 600-ball FineLine BGA | 672-ball FineLine BGA (FC) |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG | JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| Process Technology | SRAM-based CMOS | 0.25 um CMOS, 5-layer metal |
| Product Type | — | FPGA (Field Programmable Gate Array) |
| Maximum Typical Gates | — | 250,000 |
| Logic Elements (LEs) | — | 12,160 |
| Embedded Memory (EAB) | — | 655,360 bits (80 EABs x 2,048 bits each) |
| Logic Array Blocks (LABs) | — | 392 (8 LEs per LAB) |
| User I/O Pins | — | 470 |
| Temperature Grade | — | Commercial (0C to +70C) |
| Ball Pitch | — | 1.0 mm |
| Montageart | — | Surface Mount |
| RoHS-Status | — | [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |