EPF6010ATC100-3 vs EPF6016AFC256-3 Vergleich
Detaillierter Direktvergleich von EPF6010ATC100-3 von Intel und EPF6016AFC256-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF6010ATC100-3 | EPF6016AFC256-3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18,90 | $22,10 |
| Family | FLEX 6000 | FLEX 6000 |
| Logic Elements / Cells | 880 | — |
| Usable Gates | 10,000 | — |
| Logic Array Blocks (LABs) | 88 | 132 |
| User I/O Pins | 71 | — |
| Process Technology | 0.42 µm CMOS SRAM | 0.42 µm CMOS |
| Supply Voltage (VCCINT) | 3.3 V | — |
| I/O Voltage Tolerance | 3.3 V / 5 V tolerant | — |
| Speed Grade | -3 (commercial, slowest grade) | -3 |
| Gehäuse | TQFP-100 (100-pin) | 256-ball FineLine BGA (FBGA) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Configuration Memory | SRAM (external configuration device required) | — |
| JTAG Support | Yes (IEEE 1149.1) | — |
| Betriebstemperatur | 0C to +70C (commercial) | 0 °C to +85 °C (commercial) |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Equivalent Gates | — | 16K |
| Logic Elements (LEs) | — | 1320 |
| User I/Os | — | 171 |
| Maximum Internal Frequency | — | 142.86 MHz |
| Edge Rate | — | 172 MHz |
| Core Supply Voltage | — | 3.3 V |
| Pin-Anzahl | — | 256 |
| Configuration Method | — | SRAM (volatile, requires external PROM) |
| Programming Interface | — | JTAG (IEEE 1149.1) |