EPM2210F256C3N vs EPM1270F256C5N Vergleich
Detaillierter Direktvergleich von EPM2210F256C3N von Intel und EPM1270F256C5N von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM2210F256C3N | EPM1270F256C5N |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $47,10 | $16,20 |
| Series | MAX II | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | CPLD (Complex Programmable Logic Device) |
| Programmable Type | In System Programmable (JTAG, IEEE 1149.1) | Non-volatile flash, in-system programmable |
| Macrocells | 1700 | — |
| Logic Elements / Blocks | 2210 | — |
| Number of User I/Os | 204 | — |
| Maximum Propagation Delay (tPD) | 7 ns | — |
| Maximum Internal Frequency (fMAX) | 304 MHz | — |
| Internal Supply Voltage | 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail) | — |
| I/O Standard Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt) | — |
| User Flash Memory | 8 Kbits | — |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| Betriebs-Sperrschichttemperatur | 0 C to 85 C (commercial, TJ suffix 'C') | — |
| Gehäuse | 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch | — |
| Montageart | Surface Mount | Surface Mount |
| Process Technology | 0.18 um flash CMOS | 0.18 µm |
| RoHS-Status | Compliant (per DigiKey product page) | Details (per distributor product page) |
| MSL-Level | 3 (per JEDEC J-STD-020, typical for FBGA) | — |
| Family | — | EPM1270 |
| Number of Macrocells | — | 980 |
| Number of Logic Elements | — | 1270 |
| Number of User I/O | — | 212 |
| Propagation Delay (tPD) | — | 6.2 ns |
| Maximum Frequency (fMAX) | — | 201.1 MHz |
| Supply Voltage - Internal | — | 2.5 V / 3.3 V |
| Betriebstemperatur | — | 0°C to 85°C (TJ) |
| Gehäuse / Bauform | — | 256-FBGA (256-BGA) |
| Supplier Device Package | — | 256-FBGA |
| Programming Interface | — | JTAG (IEEE 1149.1) / ISP |