EPM2210F256C3N vs EPM1270F256C5N Comparación
Comparación detallada lado a lado de EPM2210F256C3N por Intel y EPM1270F256C5N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM2210F256C3N | EPM1270F256C5N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $47,10 | $16,20 |
| Series | MAX II | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | CPLD (Complex Programmable Logic Device) |
| Programmable Type | In System Programmable (JTAG, IEEE 1149.1) | Non-volatile flash, in-system programmable |
| Macrocells | 1700 | — |
| Logic Elements / Blocks | 2210 | — |
| Number of User I/Os | 204 | — |
| Maximum Propagation Delay (tPD) | 7 ns | — |
| Maximum Internal Frequency (fMAX) | 304 MHz | — |
| Internal Supply Voltage | 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail) | — |
| I/O Standard Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt) | — |
| User Flash Memory | 8 Kbits | — |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| Temperatura de unión de funcionamiento | 0 C to 85 C (commercial, TJ suffix 'C') | — |
| Encapsulado | 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Process Technology | 0.18 um flash CMOS | 0.18 µm |
| Estado RoHS | Compliant (per DigiKey product page) | Details (per distributor product page) |
| Nivel MSL | 3 (per JEDEC J-STD-020, typical for FBGA) | — |
| Family | — | EPM1270 |
| Number of Macrocells | — | 980 |
| Number of Logic Elements | — | 1270 |
| Number of User I/O | — | 212 |
| Propagation Delay (tPD) | — | 6.2 ns |
| Maximum Frequency (fMAX) | — | 201.1 MHz |
| Supply Voltage - Internal | — | 2.5 V / 3.3 V |
| Temperatura de funcionamiento | — | 0°C to 85°C (TJ) |
| Encapsulado / Carcasa | — | 256-FBGA (256-BGA) |
| Supplier Device Package | — | 256-FBGA |
| Programming Interface | — | JTAG (IEEE 1149.1) / ISP |