EPM2210F256C5N vs EPM2210F256C3N Vergleich
Detaillierter Direktvergleich von EPM2210F256C5N von Intel und EPM2210F256C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM2210F256C5N | EPM2210F256C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $17,85 | $47,10 |
| Family | MAX II | — |
| Logic Elements | 2210 | — |
| Macrocells | 1700 | 1700 |
| User I/Os | 204 | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| Propagation Delay (tPD) | 7 ns | — |
| Turn-On Delay (tSU) | 11.2 ns | — |
| Maximum Internal Frequency | 201.1 MHz | — |
| Supply Voltage (VCCINT) | 2.375 V to 3.6 V (3.3 V typical) | — |
| I/O Voltage Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | 0.18 um CMOS with on-chip flash | 0.18 um flash CMOS |
| Global Clocks | 4 | — |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Gehäuse | 256-ball FineLine BGA (17x17mm, 1mm pitch) | 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch |
| Montageart | Surface Mount | Surface Mount |
| Configuration Memory | Internal flash (non-volatile, instant-on) | On-chip flash (non-volatile, instant-on) |
| Programming Interface | JTAG (IEEE 1149.1) / ByteBlaster / USB-Blaster | — |
| RoHS-Status | Compliant | Compliant (per DigiKey product page) |
| Lead-Free | Yes | — |
| Series | — | MAX II |
| Device Type | — | CPLD (Complex Programmable Logic Device) |
| Programmable Type | — | In System Programmable (JTAG, IEEE 1149.1) |
| Logic Elements / Blocks | — | 2210 |
| Number of User I/Os | — | 204 |
| Maximum Propagation Delay (tPD) | — | 7 ns |
| Maximum Internal Frequency (fMAX) | — | 304 MHz |
| Internal Supply Voltage | — | 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail) |
| I/O Standard Support | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt) |
| User Flash Memory | — | 8 Kbits |
| Betriebs-Sperrschichttemperatur | — | 0 C to 85 C (commercial, TJ suffix 'C') |
| MSL-Level | — | 3 (per JEDEC J-STD-020, typical for FBGA) |