EPM2210F256C5N vs EPM570F256C4N Vergleich
Detaillierter Direktvergleich von EPM2210F256C5N von Intel und EPM570F256C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM2210F256C5N | EPM570F256C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $17,85 | $26,85 |
| Family | MAX II | — |
| Logic Elements | 2210 | 570 LE |
| Macrocells | 1700 | 440 |
| User I/Os | 204 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbit |
| Propagation Delay (tPD) | 7 ns | — |
| Turn-On Delay (tSU) | 11.2 ns | — |
| Maximum Internal Frequency | 201.1 MHz | 304 MHz |
| Supply Voltage (VCCINT) | 2.375 V to 3.6 V (3.3 V typical) | — |
| I/O Voltage Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | 0.18 um CMOS with on-chip flash | 0.18 µm 6-layer-metal flash |
| Global Clocks | 4 | — |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Gehäuse | 256-ball FineLine BGA (17x17mm, 1mm pitch) | 256-ball FineLine BGA (FBGA) |
| Montageart | Surface Mount | Surface Mount |
| Configuration Memory | Internal flash (non-volatile, instant-on) | — |
| Programming Interface | JTAG (IEEE 1149.1) / ByteBlaster / USB-Blaster | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Series | — | MAX II |
| Logic Array Blocks (LABs) | — | 57 |
| User I/O Count | — | 160 |
| Package Size | — | 17 mm × 17 mm |
| Pin-to-Pin Logic Delay | — | 5.4 ns |
| Operating Supply Voltage (VCCINT) | — | 2.5 V, 3.3 V |
| MultiVolt I/O Voltages | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Betriebstemperaturbereich | — | 0 °C to +70 °C (commercial) |
| In-System Programmability (ISP) | — | Yes (JTAG) |