EPM2210F256C5N vs EPM570F256C4N Comparación
Comparación detallada lado a lado de EPM2210F256C5N por Intel y EPM570F256C4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM2210F256C5N | EPM570F256C4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,85 | $26,85 |
| Family | MAX II | — |
| Logic Elements | 2210 | 570 LE |
| Macrocells | 1700 | 440 |
| User I/Os | 204 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbit |
| Propagation Delay (tPD) | 7 ns | — |
| Turn-On Delay (tSU) | 11.2 ns | — |
| Maximum Internal Frequency | 201.1 MHz | 304 MHz |
| Supply Voltage (VCCINT) | 2.375 V to 3.6 V (3.3 V typical) | — |
| I/O Voltage Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | 0.18 um CMOS with on-chip flash | 0.18 µm 6-layer-metal flash |
| Global Clocks | 4 | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | — |
| Encapsulado | 256-ball FineLine BGA (17x17mm, 1mm pitch) | 256-ball FineLine BGA (FBGA) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Memory | Internal flash (non-volatile, instant-on) | — |
| Programming Interface | JTAG (IEEE 1149.1) / ByteBlaster / USB-Blaster | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Series | — | MAX II |
| Logic Array Blocks (LABs) | — | 57 |
| User I/O Count | — | 160 |
| Package Size | — | 17 mm × 17 mm |
| Pin-to-Pin Logic Delay | — | 5.4 ns |
| Operating Supply Voltage (VCCINT) | — | 2.5 V, 3.3 V |
| MultiVolt I/O Voltages | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Rango de temperatura de funcionamiento | — | 0 °C to +70 °C (commercial) |
| In-System Programmability (ISP) | — | Yes (JTAG) |