EPM2210F324C3N - 2210 LE MAX II CPLD, 7ns, 324-FBGA | Intel
Teilenummer: EPM2210F324C3N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $101.47 | $101,47 |
| 10 | $92.5 | $925,00 |
| 100 | $78.3 | $7.830,00 |
| 250 | $71.8 | $17.950,00 |
| 500 | $65.2 | $32.600,00 |
EPM2210F324C3N Übersicht
What is a CPLD? A Complex Programmable Logic Device is a non-volatile programmable logic IC that combines the instant-on, deterministic behavior of traditional PAL/GAL architectures with higher logic density, in-system flash programmability (ISP), and integrated user flash memory. Within the programmable logic hierarchy (CPLD -> programmable logic -> digital IC -> semiconductor), MAX II devices target glue-logic, interface bridging, and power-up controller applications where instant-on non-volatile configuration is essential and FPGA-class densities are not required.
Key features include 272 maximum user I/Os, 4 global clock networks, JTAG 1149.1 boundary-scan support, and on-chip flash configuration memory that eliminates external boot PROMs. The integrated UFM block (8 Kbits) provides non-volatile parameter storage accessible through dedicated interface logic, replacing small EEPROMs in many designs. Enhanced in-system programmability (ISP) and a built-in Joint Test Action Group (JTAG) interface enable rapid prototyping and field upgrades.
The MAX II architecture uses a Logic Array Block (LAB) matrix connected by a MultiTrack interconnect, with each LAB containing 16 Logic Elements (LEs). Each LE combines a 4-input LUT, a programmable register, and dedicated carry/control logic, delivering 7 ns tPD1 propagation delay at industrial temperature and voltage corners.
Typical applications include bus-interface bridging (e.g., 8-bit MCU to 16/32-bit peripheral), power-up sequence controllers, I/O expansion for ASSPs, LED display multiplexing, and configuration EEPROM replacement. Designers choose the EPM2210F324C3N when instant-on non-volatile logic, low standby power, and the highest I/O count in the MAX II family are required in a compact 19 x 19 mm BGA footprint.
Design consideration: the FBGA-324 package requires careful PCB layout with microvia or via-in-pad technology for reliable assembly; verify the PCB fabrication capability before committing to this package. Quartus II (legacy) or Quartus Prime (current) software is required for design entry, synthesis, and programming - ensure toolchain support is available.
This page synthesizes distributor pricing, MAX II family cross-references, and PCB-level design notes not found in a single manufacturer document, enabling faster sourcing and replacement decisions for engineers and procurement teams.
Drop-in-Alternativen für EPM2210F324C3N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPM2210F324C3N (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, Programming Interface, RoHS Status, Configuration Memory.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPM2210F324C4N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EPM2210F324C5N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EPM2210F324C3
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EPM2210F324I5N
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EPM2210F324C3N Grenzwerte & elektrische Eigenschaften
| Device Family | MAX II |
| Logic Elements (LE) | 2,210 |
| Equivalent Macrocells | 1,700 |
| User Flash Memory (UFM) | 8 Kbits |
| Maximum User I/Os | 272 |
| Pin-to-Pin Delay (tPD1) | 7 ns (commercial speed grade) |
| Global Clock Networks | 4 |
| Core Voltage | 1.8 V |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Gehäuse | FBGA-324 (324-ball FineLine BGA, 19 x 19 mm, 1.0 mm pitch) |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| Programming Interface | JTAG 1149.1 (in-system programmable, ISP) |
| Betriebstemperatur | 0C to +85C (commercial) |
| Process Technology | 6-layer-metal CMOS, flash-based |
| RoHS-Status | Lead-free (per datasheet) |
| Design Software | Quartus II / Quartus Prime (Intel FPGA) |
EPM2210F324C3N fbga-324 (324-ball fineline bga, 19 x 19 mm, 1.0 mm pitch) Pinbelegungsleitfaden
Pinbelegung für EPM2210F324C3N (fbga-324 (324-ball fineline bga, 19 x 19 mm, 1.0 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPM2210F324C3N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPM2210F324C3N ist geeignet für 6 Anwendungs: Bus Interface Bridging and Glue Logic, Power-Up Sequence Controller, I/O Expansion and Address Decode for ASSPs, LED Display Multiplexing and Scan Controllers, Configuration EEPROM Replacement, Industrial Control and Factory Automation.
Bus Interface Bridging and Glue Logic
The EPM2210F324C3N's 7 ns tPD1 propagation delay and 272 user I/Os make it ideal for bridging asynchronous bus widths (e.g., 8-bit MCU to 16/32-bit ASIC or memory) in industrial control and embedded systems. The 2210 logic elements provide ample capacity for address decoding, wait-state generation, and interrupt steering that would otherwise require multiple 74-series TTL packages, while the on-chip flash UFM (8 Kbits) stores non-volatile configuration or board-identity parameters. Placed near the bus connectors, the FBGA-324 footprint routes cleanly to dense pin arrays. Unlike FPGAs, instant-on non-volatile configuration means no boot PROM and no warm-up delay, critical for fail-safe industrial applications.
Empfohlen
Power-Up Sequence Controller
The EPM2210F324C3N is widely deployed as a multi-rail power-up sequencer in ATCA/uTCA backplanes, server motherboards, and FPGA-based add-in cards where deterministic timing of voltage rail enable signals is required. Its instant-on flash configuration and 4 global clock networks enable precise programmable delays between enables, while the MultiVolt I/O (1.5 V to 3.3 V) directly drives most PMBus-compatible supervisors without external level shifters. The 8 Kbit UFM block stores sequencing profiles, fault thresholds, and board revision codes. The C3 speed grade's 7 ns tPD keeps timing margin tight relative to FPGA-based sequencing, which typically adds tens of nanoseconds of boot latency.
Empfohlen
I/O Expansion and Address Decode for ASSPs
The EPM2210F324C3N adds chip-select decode, interrupt steering, and bus-multiplexing to ASSPs and microcontrollers that lack sufficient native I/O. In set-top boxes, point-of-sale terminals, and industrial HMIs, it expands 32 GPIO to 100+ via I2C/SPI-to-parallel bridge logic, offloading main CPU cycles. The 272 user I/Os accommodate multiple peripheral banks simultaneously, and the JTAG 1149.1 interface simplifies board-level boundary-scan test coverage. Quartus Prime synthesis supports Verilog, VHDL, and schematic entry, allowing rapid port from 74HC logic schematics into a single chip.
Empfohlen
LED Display Multiplexing and Scan Controllers
The EPM2210F324C3N drives large multi-segment LED matrix displays in scoreboards, traffic signage, and instrumentation front panels by providing high-current row/column scanning with precise timing. Its 272 user I/Os handle row enables and column data for displays up to 16 rows x 16 columns directly, while the deterministic 7 ns timing supports PWM dimming without flicker artifacts. The on-chip flash UFM stores display fonts, animation patterns, and brightness curves that survive power cycles. MultiVolt I/O allows direct interfacing with 3.3 V LED driver shift registers without level translation.
Empfohlen
Configuration EEPROM Replacement
The EPM2210F324C3N's 8 Kbit User Flash Memory (UFM) block replaces external serial EEPROMs used for storing board identification, calibration constants, and user preferences in industrial and embedded designs. Accessible via JTAG or a dedicated 4-wire serial interface (SCLK, SDIN, SDOUT, CS), the UFM supports up to 100,000 erase/program cycles and 100 years of data retention. Combined with the CPLD's programmable logic, this provides a single-chip solution for boards that would otherwise need a CPLD plus a 24LC-series EEPROM, reducing BOM cost and PCB area.
Empfohlen
Industrial Control and Factory Automation
The EPM2210F324C3N's deterministic timing, instant-on non-volatile configuration, and 272 I/Os suit factory automation controllers, PLC I/O modules, and motor-control interfaces where reliability and predictable latency are paramount. Its commercial temperature range (0C to +85C) covers most factory-floor environments, and the FBGA-324 package withstands high-vibration mounting when properly board-attached. The MAX II architecture resists single-event upsets better than SRAM-based FPGAs, making it preferable for industrial PLC applications where configuration corruption cannot be tolerated. Quartus Prime supports industrial-grade IP libraries for motor-control PWM generation and encoder decoding.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPM2210F324C3N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPM2210F324C4N | EPM2210F324C5N | EPM2210F324C3 | EPM2210F324I5N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-324 (19x19 mm, 1.0 mm pitch) | FBGA-324 (19x19 mm, 1.0 mm pitch) - same | FBGA-324 (19x19 mm, 1.0 mm pitch) - same | FBGA-324 (19x19 mm, 1.0 mm pitch) - same | FBGA-324 (19x19 mm, 1.0 mm pitch) - same |
| Logic Elements | 2,210 | 2,210 | 2,210 | 2,210 | 2,210 |
| Pin-to-Pin Delay (tPD1) | 7 ns | ~8 ns (+14%) | 9.1 ns (+30%) | 7 ns (same) | 9.1 ns (+30%) |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Maximum User I/Os | 272 | 272 | 272 | 272 | 272 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Lead-Free / RoHS | Lead-free (N suffix) | Lead-free (N suffix) | Lead-free (N suffix) | Non-lead-free (no N suffix) | Lead-free (N suffix) |
Wichtigste Unterscheidungsmerkmale
- Fastest speed grade in MAX II family at this density (vs. EPM2210F324C4N / EPM2210F324C5N)
- Highest I/O count in the MAX II CPLD family (vs. EPM2210F256C3N)
- Commercial temperature grade with lowest cost in this speed tier (vs. EPM2210F324I5N)
Designhinweise
The FBGA-324 package uses 1.0 mm ball pitch and 19 x 19 mm body - require PCB fabrication capability for 0.4 mm via-pad microvias or via-in-pad (VIPPO) technology. Standard 1.6 mm FR-4 with 1 oz copper and 0.2 mm laser-drilled vias is the typical baseline. Always include a 4 to 6 mil soldermask dam between adjacent BGA balls and route escape traces on inner layers with microvia stacks. Estimated: a 4-layer stack-up with 0.2 mm microvias is sufficient for the 1.0 mm pitch; 1.0 mm standard through-vias cannot escape an FBGA at this pitch without dog-bone fanout.
Decouple each VCCINT (1.8 V core) and VCCIO (I/O bank) ball with a 0.1 uF X7R ceramic capacitor placed within 2 mm of the respective ball, plus a bulk 10 uF tantalum or ceramic per voltage rail. The MAX II datasheet specifies 8 to 16 decoupling capacitors depending on utilization rate. Add a ferrite bead on each supply rail if the source is a switching regulator; the CPLD's 272 outputs can inject significant switching noise into the power plane during simultaneous toggling.
For designs using all 272 I/Os at high toggle rates, route clock signals on inner stripline layers with controlled impedance (50 ohm single-ended or 90 ohm differential per LVDS). Use the 4 global clock networks for high-fanout signals to minimize skew; local routing is acceptable for low-frequency signals. Estimated: at 100 MHz LVCMOS output, expect approximately 25 mA peak current per switching I/O and budget the power plane accordingly to avoid IR-drop-induced timing violations.
Do not assume the EPM2210F324C3N and EPM2210F324C5N have identical JTAG IDs - while both are in-system programmable, the silicon revision differs between speed grades and Quartus II may flag a mismatch during download. Verify the design's timing constraints are met when substituting between C3, C4, and C5 grades, as tPD scales from 7 ns to 9.1 ns. The UFM block supports only 100,000 write cycles - do not use it for high-update-rate data logging without external wear-leveling logic.
Compliance-Informationen
Lead-free per N-suffix nomenclature; RoHS and REACH compliance per Intel product page. Not AEC-Q100 qualified - automotive applications should use the EPM2210F256A5NGA variant from the same MAX II family.
