EPM240GT100C3 vs EPM240F100C5N Vergleich
Detaillierter Direktvergleich von EPM240GT100C3 von Intel und EPM240F100C5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM240GT100C3 | EPM240F100C5N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,95 | $5,20 |
| Family | MAX II | — |
| Logic Elements (LE) | 240 | — |
| Equivalent Macro Cells | 192 | — |
| Pin-to-Pin Delay (tPD) | 4.7 ns | — |
| Maximum Internal Frequency (fMAX) | 304 MHz | — |
| User I/O Count | 80 | — |
| User Flash Memory (UFM) | 8 Kbit | — |
| Process Technology | 0.18 µm 6-layer-metal flash | — |
| Core Supply Voltage | 1.8 V (internal) | — |
| I/O Bank Voltages (MultiVolt) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Programming Interface | IEEE 1149.1 JTAG (ISP) | JTAG / ByteBlasterMV |
| Gehäuse | TQFP-100 (100-TQFP, 16 × 16 mm, 0.5 mm pitch) | 100-ball FineLine BGA (FBGA-100) |
| Betriebstemperatur | 0 °C to 85 °C (commercial, C3 suffix) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| MSL-Level | 3 (168 hours) | — |
| Device Family | — | MAX II |
| Logic Elements (LEs) | — | 240 |
| Macrocells | — | 192 |
| User I/O Pins (maximum) | — | 80 |
| Pin-to-Pin Logic Delay (tPD) | — | 4.7 ns |
| Maximum Operating Frequency | — | [DATA_NEEDED: fmax per datasheet] |
| Global Clock Networks | — | [DATA_NEEDED: count] |
| Betriebstemperaturbereich | — | 0C to +85C (commercial) |
| Supply Voltage Core (VCCINT) | — | 3.3 V |
| I/O Bank Voltage (VCCIO) | — | 1.5V / 1.8V / 2.5V / 3.3V (MultiVolt) |
| Configuration Memory | — | Non-volatile flash (instant-on) |
| JTAG Support | — | IEEE 1149.1 boundary-scan |
| RoHS-Status | — | Compliant |