EPM240GT100C3 vs EPM240F100C5N Comparación
Comparación detallada lado a lado de EPM240GT100C3 por Intel y EPM240F100C5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM240GT100C3 | EPM240F100C5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9,95 | $5,20 |
| Family | MAX II | — |
| Logic Elements (LE) | 240 | — |
| Equivalent Macro Cells | 192 | — |
| Pin-to-Pin Delay (tPD) | 4.7 ns | — |
| Maximum Internal Frequency (fMAX) | 304 MHz | — |
| User I/O Count | 80 | — |
| User Flash Memory (UFM) | 8 Kbit | — |
| Process Technology | 0.18 µm 6-layer-metal flash | — |
| Core Supply Voltage | 1.8 V (internal) | — |
| I/O Bank Voltages (MultiVolt) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Programming Interface | IEEE 1149.1 JTAG (ISP) | JTAG / ByteBlasterMV |
| Encapsulado | TQFP-100 (100-TQFP, 16 × 16 mm, 0.5 mm pitch) | 100-ball FineLine BGA (FBGA-100) |
| Temperatura de funcionamiento | 0 °C to 85 °C (commercial, C3 suffix) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Nivel MSL | 3 (168 hours) | — |
| Device Family | — | MAX II |
| Logic Elements (LEs) | — | 240 |
| Macrocells | — | 192 |
| User I/O Pins (maximum) | — | 80 |
| Pin-to-Pin Logic Delay (tPD) | — | 4.7 ns |
| Maximum Operating Frequency | — | [DATA_NEEDED: fmax per datasheet] |
| Global Clock Networks | — | [DATA_NEEDED: count] |
| Rango de temperatura de funcionamiento | — | 0C to +85C (commercial) |
| Supply Voltage Core (VCCINT) | — | 3.3 V |
| I/O Bank Voltage (VCCIO) | — | 1.5V / 1.8V / 2.5V / 3.3V (MultiVolt) |
| Configuration Memory | — | Non-volatile flash (instant-on) |
| JTAG Support | — | IEEE 1149.1 boundary-scan |
| Estado RoHS | — | Compliant |