EPM570F256C4 vs EPM570F256C3N Vergleich
Detaillierter Direktvergleich von EPM570F256C4 von Intel und EPM570F256C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM570F256C4 | EPM570F256C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $19,95 | $13,75 |
| Family | MAX II | MAX II |
| Device Name | EPM570 | — |
| Logic Elements (LEs) | 570 | 570 |
| Maximum User I/O Pins | 212 | — |
| User Flash Memory | 8 Kbits | — |
| Pin-to-Pin Logic Delay (tPD) | 4.5 ns (commercial -4 speed grade) | — |
| Supply Voltage - Core (VCCINT) | 1.8 V | — |
| Supply Voltage - I/O (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Gehäuse | 256-ball FineLine BGA (F256) | 256-ball FBGA (FineLine BGA) |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | 3 (168 hours) | [DATA_NEEDED: MSL level not stated in provided data] |
| Lead-Free / RoHS | Yes (lead-free finish, RoHS compliant per product page) | — |
| Configuration Memory | Internal Flash (non-volatile, instant-on) | — |
| Global Clock Networks | 4 | — |
| Equivalent Macrocells | — | 440 |
| User Flash Memory (UFM) | — | 8 Kbits |
| Maximum Operating Frequency | — | 304 MHz |
| Process Technology | — | 0.18 um, 6-layer-metal flash CMOS |
| Core Voltage | — | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| User I/O Count | — | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| Operating Temperature (C3 grade) | — | 0 C to +85 C (commercial) |
| RoHS-Status | — | Compliant (per DigiKey listing) |
| Lead-Free | — | Yes (per suffix 'N' convention) |
| Typical Macroscopic Functions | — | Glue logic, bus bridging, I/O expansion, power sequencing |