EPM570F256C5NRR vs EPM570F256C3N Vergleich
Detaillierter Direktvergleich von EPM570F256C5NRR von Intel und EPM570F256C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM570F256C5NRR | EPM570F256C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10,90 | $13,75 |
| Series | MAX II | — |
| Family | MAX II (CPLD) | MAX II |
| Logic Elements | 570 | — |
| Macro Cells | 440 | — |
| Pin-to-Pin Delay (tPD) | 8.7 ns (C5 speed grade) | — |
| Internal fMAX | 201.1 MHz | — |
| User Flash Memory (UFM) | 8 Kbytes | 8 Kbits |
| Maximum User I/O Pins | 212 (typical, 256-BGA) | — |
| Operating Supply Voltage - Core (VCCINT) | 2.5 V (3.3 V tolerant) | — |
| Operating Supply Voltage - I/O (VCCIO) | 2.5 V or 3.3 V | — |
| Process Technology | 0.18 µm flash CMOS | 0.18 um, 6-layer-metal flash CMOS |
| Gehäuse | 256-ball FBGA (FineLine BGA) | 256-ball FBGA (FineLine BGA) |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0 °C to +85 °C (commercial, C-speed grade) | — |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| Configuration Memory | On-chip non-volatile flash | — |
| RoHS-Status | Compliant | Compliant (per DigiKey listing) |
| Logic Elements (LEs) | — | 570 |
| Equivalent Macrocells | — | 440 |
| Maximum Operating Frequency | — | 304 MHz |
| Core Voltage | — | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| User I/O Count | — | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| Operating Temperature (C3 grade) | — | 0 C to +85 C (commercial) |
| MSL-Level | — | [DATA_NEEDED: MSL level not stated in provided data] |
| Lead-Free | — | Yes (per suffix 'N' convention) |
| Typical Macroscopic Functions | — | Glue logic, bus bridging, I/O expansion, power sequencing |